Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Materials, Free Full-Text

The effect of lanthanum chloride on the electrocrystallization behavior of cobalt and grain refinement in deposition layers

CO2 electrolysis: Advances and challenges in electrocatalyst engineering and reactor design - ScienceDirect

Metal-graphene interfaces in epitaxial and bulk systems: A review - ScienceDirect

蕴雯 WU, Waseda University, Tokyo, Sōdai, Department of Applied Chemistry

Impact of aspect ratio and line spacing on microstructure in damascene Cu interconnects

Advance in additive manufacturing of 2D materials at the atomic and close-to-atomic scale

Sensors, Free Full-Text

Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints

Linear Sweep Voltammetric Study on the Copper Electrodeposition of Though-Silicon-Vias

Effect of die/substrate thickness ratio on Al pad stresses, under a

Materials, Free Full-Text

The effect of lanthanum chloride on the electrocrystallization behavior of cobalt and grain refinement in deposition layers