Local Heat Dissipation and Elasticity of Suspended Silicon

Local Heat Dissipation and Elasticity of Suspended Silicon

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Heat conduction measurements in ballistic 1D phonon waveguides

Strain engineering of two‐dimensional materials: Methods

Actuators, Free Full-Text

Jose Manuel SOJO GORDILLO, PostDoc Position, Doctor in Material Science

a) Test device with hexagonal Si and tungsten structures used for

Power spectrum density (PSD) of thermal noise induced deflection

Temperature-dependent phonon MFP spectra for c-Si.MFP spectra for

Spectral emittance by closure ( = 1 0 0 ) for p-type silicon

High thermal conductivity in wafer-scale cubic silicon carbide

Jose Manuel Sojo Gordillo - Swiss Nanoscience Institute (SNI), University of Basel

Publications – Albert Tarancon's

Temperature and interlayer coupling induced thermal transport

Main steps of the fabrication process. The suspended beam is

Comparison of simulated dependences of the spreading thermal resistance