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Microstructural evolution of gold–aluminum wire-bonds
Microstructural evolution of gold–aluminum wire-bonds
Influence of selective laser melting scanning speed parameter on
Transmission electron microscopy - Wikipedia
Example crescent bond. (a) BSE-SEM micrograph and location of
SEM micrographs of bonding interfaces of (a) as-bonded substrate
Frontiers A review on experimentally observed mechanical and
PDF) Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump
Young-Kyu Song's research works
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The effect of size, orientation and temperature on the deformation