A study of thermal cycling and radiation effects on indium and

The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost fine-pitch flip-chip attachment technology. We have tested the quality of two bump-bonding technologies; indium bumps (by Advanced Interconnect Technology Ltd. (AIT) of Hong Kong) and fluxless solder bumps (by MCNC in North Carolina, USA). The results have been presented elsewhere [1]. In this paper we describe tests we performed to further evaluate these technologies. We subjected 15 indium bump-bonded and 15 fluxless solder bump-bonded dummy detectors through a thermal cycle and then a dose of radiation to observe the effects of cooling, heating and radiation on bump-bonds. We also exercised the processes of HDI mounting and wire bonding to some of the dummy detectors to see the effect of these processes on bump bonds.

Thermal Cycling Study

The latest SWIR tech for inspecting semiconductor wafers

Ultraviolet Lasers, UV Lasers, Diodes, & Modules

DSC curves showing 9.1mg of indium sample experimented at

High thermal conductivity in indium-based metal/diamond composites

Fermin REYGADAS, Executive Director, PhD

Van Allen Probes - eoPortal

Nanomechanical Instruments for SEM/TEM

HgCdTe Detector Chip Technology

Delafosse CHRISTIAN, Medical Doctor, Hospital Simone Veil, Montmorency, department of pneumology

Effect of thermal annealing on SHI irradiated indium implanted